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Molding System |
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Device lineup and Applicable Package
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Molding System Lineups < Compression Molding >
CDIM-200 |
Automated Cavity Direct Injection Molding System |
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For the last few decades Transfer molding technology has been at the height of its prosperity. Now, this technology is facing its physical limitations for the packaging of the forefront devices, because of the further miniaturization, longer wire, narrower wire pitch, multi layer dies, Low-K material, etc.
The liquid compression molding, CDIM® technology is the best solution for these forefront devices, such as PoP, Multi-chip modules, as well as LED lens.
This fully automated CDIM-200 shall materialize the new packages,which are still in your imagination. |
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WCM-300L |
Fully Automated WLP Molding System |
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Here is the World-first Fully Automated 12” WLP molding system, WCM-300L.
First WLP device came out 10 years ago. After the technical break through, now real mass-production started.
Apic Yamada materialized the WLP molding technology in ’97.
Now incorporating all know-how and technologies, the world’s 1st fully automated WLP molding system WCM-300L is coming out to the market.
WCM-300L has in-line concept for wafer loading/unloading, compound feeding, encapsulation and vision inspection.
This system handles the wafer without any damage nor contamination and encapsulate high quality products. The press system is high precision mechanical press, specially developed for WLP. This system can handle either liquid or granular compound to accommodate to the customer’s requirement.
In addition to the system features, the production control software, A-MICS* is provided to monitor all system’s production status from the office.
* A-MICS is the name of product for the production control software, Apicyamada Machine Information Collection System. |
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WCM-300 Manual System |
Manual Molding System for WLP packaging |
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High precision Manual Molding system dedicated to Wafer Level Packaging.
This system is chasing the ultimate platen parallelism to achieve the WLP quality. Now, WCM-300 manual system is put into the market for the wider molding variation of 12” wafer packaging. |
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Molding System Lineups < Transfer Molding >
LTM-120L |
Liquid Transfer Encapsulation System |
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Since the invention of Blue LED, its application and market are growing day by day. Now the High power white LED, which is so called “Third revolution of lighting” requires longer life encapsulant to its lens, such as Silicone molding compound.
LTM-120L is the fully automated transfer molding system for liquid encapsulant. This system is developed, as the succeeded system of LTM-100 to have more accurate and user friendly dispensing mechanism.
Transfer molding is well known as highly accurate encapsulation technology and high through put as well. Also the liquid compound guarantees the clean environment.
Almost all interposer, starting from lead fame to ceramic substrate can be applicable. |
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G-LINE |
Module Type Auto-molding System |
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This is the fully automated molding system with the modular type design concept to accommodate to the customer’s required production volume.
FAME® (Film Assisted Molding Equipment) and other various auxiliary options are available to fit your production needs. |
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FAME®UNIT/H/S Loader Module/Vacuum strip hold unit/Individual pressure equalizer for Substrate/Vacuum Molding Unit/Retractable Pin Unit |
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G-Grande100 |
Molding system for large scale ECU |
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Automobile is now facing the time of revolution, such as hybrid cars and high tech control system by means of the most advanced electrical technologies. The engine controller and the transmission controllers, use to be sealed in the Aluminum case are directly encapsulated and are being installed closer to the main body of each equipment.
G-Grande100 is world’s first fully automated encapsulation system for this kind of electronics controller module (ECU) for the automobile.
This molding system has all required features for large package encapsulation comply with the manufacturing of the future automobiles. |
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G-ONE100 |
1-Head Auto-molding System |
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G-ONE100 contains all necessary elements for the production. Utilizing all know-how and technologies, cultivated with the experience of G-LINE, this new system is put into the market for the customer’s clean, safety and no waste production.
System features;
- 60 or 120 ton press to accommodating to your products
- Compatible with G-LINE molds and the products change kits
- Less than 40 minutes product change over - Easy access for the maintenance
- Cut down 15-20% COO - Clean environment with high performance cleaner
- Safety features to meet SEMI S2, S8 (Option)
- Wider application for 20~80W x 100~270L (mm) work |
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G-LINE Manual System
Compact Manual molding system （60/120TON） |
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This 60/120 ton manual system is designed for molding Lab or small lot production use.
AC servo motor drive clamp and transfer system materialize precise and shock less operation without hydraulic oil or cooling water. Either Transfer Molding or Compression Molding dedicated system, or compatible system can be selected. |
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