|
 |
|
Package Singulation System |
|
MAPS Series
| |
MAPS-300TS |
MAPS-370J
MAPS-340J
MAPSL-330J |
MAPS-340Laser |
| Cutting Method |
Saw Blade |
Saw Blade |
Laser |
| Holding Method |
Tape Type |
Tape-less Type |
Tape-less Type |
| Cleaning |
Vertical Jet Washing/
Wet Type |
Horizontal Washing/Wet Type |
High-speed Brushing/Dry Type |
| Straight Cutting |
Ο |
Ο |
Ο |
| Taper Cut |
Ο |
Ο |
— |
| Curve Cut |
— |
— |
Ο |
| Recommended Package |
BGAs, CSPs, MAP packages, LEDs, and Ceramic packages, WLPs, and Large-size package. |
BGAs, CSPs, MAP packages, LEDs, and Ceramic packages. |
Special devices with curving shape. |
|
（*1 MAPSL-330J Only）
|
|
Singulation process example
| Tape Process |
|
| Tape-less Process |
|
|
| * There might be un applicable packages, depending on the package design. |
|
|
|
Package Singulation System Lineups
MAPS-370J |
High speed tapeless Singulation system |
|
 |
Newly developed High speed singulation system, MAPS-370J achieves as higher as 20,000 UPH by means of high rigidity Apic-Belt package transfer, Multi-nozzle picker and motion control, also the ball surface cleaning is separated from the dicing stage to shorten the tact time. The cutting accuracy, which is the most important factor of the package singulation system is also improved by using high resolution camera for the work alignment and 2 inch spindles.
The change kit, those are currently used are utilized as well. (Modification will be required to some parts)
*UPH may vary according to IC and/or tray conditions.
MAPS-340J
High reliable Multi-function MAPS-340J to mount O/S test, laser marking and ball inspection, now allows to select the spindle size 2 or optional 3 inches. |
|
|
MAPSL-330J |
Fully Automated Substrate Singulation system |
|
 |
Utilizing the proven high precision singulation technology for the semiconductor packages, this fully automated singulation system came out to process Max. 350 x 350mm substrate with in-line process from work loading to tray off-loading including work cleaning stage. |
|
|
MAPS-340Laser |
Laser Singulation system |
|
 |
The advanced packaging sometimes requires the carved line on its packages, which can not be achieved by the saw singulation. MAPS-330Laser materialized this requirement.
To meet further customer requirement, MAPS-340Laser has been developed as the version up model to comply.
Improved points;
・ SHG (Second Harmonic Generation) Laser can be applicable to the devices require delicate cutting quality.
・ Individual stage for cleaning stage of Land side and Mold side achieves 20% higher productivity.
・ Modular type frame makes wider choice of integration of loader / unloader specification.
・ Higher rigidity of the mounted area to achieve higher cutting accuracy.
|
|
|
MAPS-300TS |
Tape type Singulation system |
|
 |
MAPS series is well known as the reliable and user friendly system.
Now, introducing new MAPS-300TS Tape type singulation system for the small package and small lot production.
This is the fully automated system for; Package loading, Singulation, Cleaning and Off-loading.
This new system promises low cost and flexible manufacturing. |
|
|
MAPS-200T |
Ring to ring・tray transport machine |
|
 |
The MAPS-220T is an automatic handler that picks up saw singulated packages on the UV tape and places them into a plastic hard tray. |
|
|
A-PATH |
UV Tape & Work Attach machine |
|
 |
Fully automated tape mounter sticks the MAP type BGA/CSP on UV tape for dicing saw singulation by means of ECO-RING.
ECO-RING guarantees the high cost efficiency by reducing UV tape consumption.
This system can be used with other adhesive tape as well. |
|
|
Copyright © APIC YAMADA CORPORATION. All rights reserved. |
|
|
