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Precision DIE-SET

Stamping Die set / Trim & Form Die set
Stamping tool manufacturing one of the core business of Apic Yamada group, which has been carried on since the foundation of company. In 1971 manufacturing of the lead frame for semiconductor device was started and the high precision tool making technology is polished up along with the requirement of high lead count. Now, the highest lead count is QFP216L with the lead pitch of 148um and the minimum lead width of 72um. This technology is also applied to the trimming and forming die set, which are required for lead cut and bend after package encapsulation.

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